Sn63/Pb37 T5 No-Clean Solder Paste – 35g Syringe
**-- THIS PRODUCT CONTAINS 1 PER PACK --**
This Sn63/Pb37 T5 no-clean solder paste is designed for high-precision electronic soldering, offering excellent flow, consistent wetting, and strong mechanical joints for PCB, IC, BGA, SMD, and CPU repair work. Its eutectic 63/37 tin-lead formulation provides a stable melting point of 183°C (361°F), ensuring smooth transitions from paste to solder without slumping or bridging.
With 15–25 micron T5-grade particles and a balanced flux content, this paste delivers clean, uniform application ideal for fine-pitch components and rework tasks. The pushing-type syringe design allows smooth, controlled dispensing with minimal waste. Suitable for repair, assembly, and maintenance across a wide range of consumer and industrial electronics.
**Specifications**
- **Alloy Composition:** Sn63 / Pb37
- **Flux Content:** 10.8%
- **Particle Size:** T5 (15–25 microns)
- **Melting Point:** 183°C (361°F)
- **Form:** 35g no-clean solder paste
- **Dispensing Style:** Pushing-type syringe
- **Use Case:** PCB, IC, BGA, SMD, CPU repair, SMT rework, electronics assembly
**Key Features**
- Eutectic 63/37 alloy for smooth, predictable soldering
- T5 particle size ideal for fine-pitch precision work
- No-clean flux formula minimizes residue and cleanup
- Smooth, controlled syringe dispensing with reduced waste
- Widely used for chip repair, SMD/BGA work, circuit boards, sensors, motors, fuses, connectors, and electronics maintenance
**-- THIS PRODUCT CONTAINS 1 PER PACK --**