Sn63/Pb37 T5 No-Clean Solder Paste – 35g Syringe

Sn63/Pb37 T5 No-Clean Solder Paste – 35g Syringe

This Sn63/Pb37 T5 no-clean solder paste is designed for high-precision electronic soldering, offering excellent flow, consistent wetting, and strong mechanical joints for PCB, IC, BGA, SMD, and CPU repair work. Its eutectic 63/37 tin-lead formulation provides a stable melting point of 183°C (361°F), ensuring smooth transitions from paste to solder without slumping or bridging.

With 15–25 micron T5-grade particles and balanced flux content, this paste delivers clean, uniform application ideal for fine-pitch components and rework tasks. The pushing-type syringe design allows smooth, controlled dispensing with minimal waste.

Sold individually (1 per pack).

Specifications

• Alloy Composition: Sn63 / Pb37
• Flux Content: 10.8%
• Particle Size: T5 (15–25 microns)
• Melting Point: 183°C (361°F)
• Net Weight: 35g
• Dispensing Style: Pushing-type syringe
• Flux Type: No-clean
• Use Case: PCB, IC, BGA, SMD, CPU repair, SMT rework, electronics assembly

Key Features

• Eutectic 63/37 alloy for smooth, predictable soldering
• T5 particle size ideal for fine-pitch precision work
• No-clean flux formula minimizes residue and cleanup
• Smooth, controlled syringe dispensing with reduced waste
• Suitable for chip repair, SMD/BGA work, circuit boards, sensors, motors, fuses, connectors, and electronics maintenance